Package substrate and a flip chip mounted semiconductor device

Details Package substrate and a flip chip mounted semiconductor device Package substrate and a flip chip mounted semiconductor device

2006-05-09

2006-05-09

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S703000

Reexamination Certificate

active

07042083

ABSTRACT:
The present invention provides a package substrate which comprises a substrate defined by top and bottom surfaces and having a plurality of perforations; a resin insulation layer configured to implement a multi-level structure disposed on both surfaces of the substrate; a built-up wiring layer implementing the multi-level structure disposed on the resin insulation layer on both surfaces of the substrate; and a semiconductor chip mounting region provided on the top or the bottom surface of the substrate; wherein, a perforation exists on any straight line connecting from the center of the substrate to an arbitrary point on a periphery of the substrate.

REFERENCES:
patent: 6333857 (2001-12-01), Kanbe et al.
patent: 6433412 (2002-08-01), Ando et al.
patent: 62-52988 (1987-03-01), None
patent: 2002-223070 (2002-08-01), None
patent: 2002-332544 (2002-11-01), None
patent: 2002-353584 (2002-12-01), None
patent: 2003-31719 (2003-01-01), None

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