High performance multi-chip flip chip package
High performance multi-chip flip chip package
High performance multi-chip flip package
High performance packaging for microprocessors and DRAM...
High performance, low cost microelectronic circuit package...
High power MCM package with improved planarity and heat...
High power semiconductor switch module
High speed electronic interconnection using a detachable...
High temperature operating package and circuit design
High-density electronic module
High-density wirebond chip interconnect for multi-chip modules
High-density, highly reliable integrated circuit assembly
High-power semiconductor module
Highly moisture-sensitive electronic device element and...
Highly reliable low cost structure for wafer-level ball grid...
Hybrid integrated circuit
Hybrid integrated circuit device
Hybrid integrated circuit device with high melting point...
Hybrid integrated circuit device, and method of...
Hybrid multichip module and methods of fabricating same