High speed electronic interconnection using a detachable...

Details High speed electronic interconnection using a detachable... High speed electronic interconnection using a detachable...

2005-04-19

2005-04-19

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S685000, C257S690000, C257S692000, C257S782000, C257S773000

Reexamination Certificate

active

06882044

ABSTRACT:
Conductors to interconnect electronic devices, the conductors being formed on a detachable substrate. The substrate is aligned with a package containing electronic devices. The conductors are bonded to pads on the devices. Then, the substrate is detached. Each conductor is self supporting between the devices, has a two dimensional shape and has a surface that is substantially parallel to a surface of the pads.

REFERENCES:
patent: 5060052 (1991-10-01), Casto et al.
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patent: 5309322 (1994-05-01), Wagner et al.
patent: 6013946 (2000-01-01), Lee et al.
patent: 6146813 (2000-11-01), Girard et al.
patent: 6177722 (2001-01-01), Kovats et al.
patent: 20020004257 (2002-01-01), Takaoka et al.
patent: 04-212167 (1992-03-01), None

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