Hybrid integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Patent

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Details

257724, 257693, 257694, H01L 2348, H01L 2334

Patent

active

055593747

ABSTRACT:
A hybrid integrated circuit includes a plurality of metal plates supporting circuit elements and connectable directly to external power/output lines. The direct connection eliminates the need for solder terminals, allowing for reduced size and cost with increased reliability and lifespan. The metal plates can be position to allow for further minimization of the device, and uniform connection of internal wiring to the circuit elements.

REFERENCES:
patent: 3105922 (1963-10-01), Fukui et al.
patent: 4819042 (1989-04-01), Kaufman
patent: 4920405 (1990-04-01), Itoh et al.
patent: 5077595 (1991-12-01), Fukunage
patent: 5130784 (1992-07-01), Saeki et al.

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