Hybrid multichip module and methods of fabricating same

Details Hybrid multichip module and methods of fabricating same Hybrid multichip module and methods of fabricating same

1995-07-12

1997-10-07

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257700, 257776, H01L 2364, H01L 23053, H01L 2348

Patent

active

056751834

ABSTRACT:
A hybrid multichip module and method for fabricating same provides a cost-effective interconnection of semiconductor chips combining the advantages of modern MCM-D technology with modern MCM-L technology. In a preferred embodiment, the hybrid multichip module has semiconductor chips mounted to an MCM-D structure and interconnected by an MCM-L structure via solder columns.

REFERENCES:
patent: 4673772 (1987-06-01), Satoh et al.
patent: 4724472 (1988-02-01), Sugimoto et al.
patent: 5276289 (1994-01-01), Satoh et al.
patent: 5367435 (1994-11-01), Andros et al.
patent: 5475264 (1995-12-01), Sudo et al.
"Hybrid Surface Mount/Pin Grid Array Package", IBM Technical Disclosure Bulletin, vol. 38 No. 01 Jan. 1995, pp. 221-222.

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