High temperature operating package and circuit design

Details High temperature operating package and circuit design High temperature operating package and circuit design

2009-04-07

2011-10-04

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S724000, C257S725000, C257SE23023

Reexamination Certificate

active

08030764

ABSTRACT:
The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.

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