Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1997-04-14
1998-10-06
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257723, H01L 2334
Patent
active
058181083
ABSTRACT:
The invention concerns an MCM type high-density assembly of integrated circuits having a high reliability by virtue of its design and the means employed in its implementation. The essential feature of the assembly is the presence of one or more interconnection substrates in addition to at least one substrate carrying a plurality of unencapsulated electronic chips connected to the interconnection substrate(s) by conventional microwiring techniques, preferably through one or more apertures in the substrates. The interconnection substrate(s) is or are advantageously of the multilayer type. The assembly is adapted to be encapsulated thereafter in a hermetically sealed case in the manner that is standard for MCM. In various embodiments the unencapsulated chips can be attached to one or both sides of a supporting substrate, respectively in conjunction with the use of one or two interconnection substrates with apertures; a plurality of sets of two or three substrates formed in this way can be stacked either in one case or in separate cases designed to be stacked; the integrated circuits can be conventional two-dimensional chips or "3D" blocks of circuits integrated in three dimensions. The invention also concerns the method of implementation. Applications in the fields of space, the military and onboard or portable electronics of high processing power or high memory capacity.
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Coello Vera Augustin
Masgrangeas Marc
Muller Eric
ALCATEL N.V.
Jackson Jerome
Kelly Nathan K.
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