Hybrid integrated circuit device

Details Hybrid integrated circuit device Hybrid integrated circuit device

1993-04-12

1995-02-07

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257726, 361785, H01L 2316

Patent

active

053878167

ABSTRACT:
A pedestal 11 is attached to a circuit substrate 1 having a component placement area 4 when clamping portions 12 and 12 of the pedestal 11 clamp both side portions 5 and 5 of the component placement area 4. It is possible to stand the hybrid integrated circuit device on a parent circuit substrate a by itself before the hybrid integrated circuit device is soldered to the parent circuit substrate a. Since the bottom surfaces of the clamping portions 12 and 12 are flat. The circuit substrates 1, 1, . . . do not overlap one another when the hybrid integrated circuit devices are accommodated in and arranged vertically in a stick since the thickness of the clamping portions 12 and 12 of the pedestal 11 is thicker than the circuit substrate 1. Accordingly, the hybrid integrated circuit device is liable to vertically stand on the parent circuit substrate a by itself and it is easily accommodated in and taken out from the stick.

REFERENCES:
patent: 4241381 (1980-12-01), Cobaugh et al.
patent: 5144532 (1992-09-01), Wessely et al.
Journal of Nippondenso Technical Disclosure, 40-411, Published on Nov. 15, 1984.

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