High-density electronic module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

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Details

257723, 257724, 257727, 257725, 257777, 361688, 361697, 361702, H01L 2316, H01L 2342

Patent

active

057148023

ABSTRACT:
A highly dense electronic module for installation into a computer or other electronic device comprises at least one wafer or wafer section and means for connection with the electronic device. With an embodiment comprising plural wafer sections, the wafer sections are mechanically joined and electrically coupled.

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