LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Encapsulated

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Stress relief matrix for integrated circuit packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

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Structure and package of a heat spreader substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Reexamination Certificate

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Structure of resin molded type semiconductor device with embedde

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Patent

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Structure, material, and design for assembling a low-K Si...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Structure, material, and design for assembling a low-K Si...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Substrate for semiconductor device and semiconductor device usin

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Patent

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Substrate for semiconductor device, semiconductor chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Substrate having a built-in chip and external connection...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Substrate strip for use in packaging semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Super low profile package with stacked dies

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Reexamination Certificate

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Surface electrical field delimiting structure for an integrated

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Patent

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System and method for hermetically sealing a package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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System for fabricating semiconductor components using mold...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Systems for degating packaged semiconductor devices with...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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