Substrate having a built-in chip and external connection...

Details Substrate having a built-in chip and external connection... Substrate having a built-in chip and external connection...

2007-12-25

2007-12-25

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S788000, C257S789000, C257S793000, C257S795000, C257SE23119, C257SE23121

Reexamination Certificate

active

11224821

ABSTRACT:
A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90% by weight of spherical filler.

REFERENCES:
patent: 5656250 (1997-08-01), Tanaka et al.
patent: 6166433 (2000-12-01), Takashima et al.
patent: 6255739 (2001-07-01), Adachi et al.
patent: 2004/0071805 (2004-04-01), Boyaud et al.
patent: 2004/0113215 (2004-06-01), Shimada et al.
patent: 2001 217381 (2001-08-01), None

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