Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2007-07-31
2007-07-31
Ho, Tu-Tu (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S678000, C257SE23125, C257SE21504, C438S112000, C438S127000, C264S272150, C264S272170
Reexamination Certificate
active
11186481
ABSTRACT:
A system for degating a packaged semiconductor device that includes a tape substrate includes a first element and a second element. The first element of the system is positionable adjacent to a first major surface of the packaged semiconductor device and includes a receptacle for receiving a portion of a gate of the packaged semiconductor device. A second element of the degating system is positionable adjacent to a second major surface of the packaged semiconductor device and includes a degating element alignable with the gate. The degating element is extendable through the gate to force a portion of the gate and a sprue therein into the receptacle of the first element.
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Lee Teck Kheng
Vijendran M
Ho Tu-Tu
Micro)n Technology, Inc.
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