Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2005-11-29
2005-11-29
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S788000, C029S841000, C029S831000, C029S832000, C029S854000, C029S740000, C029S827000, C029S840000, C264S272170, C156S345330, C438S107000, C438S014000, C438S110000, C438S015000, C438S004000, C700S121000
Reexamination Certificate
active
06969918
ABSTRACT:
A system for fabricating semiconductor components includes mating mold cavity plates having mold cavities configured to mold body segments of the semiconductor components on either side of a leadframe. The mold cavity plates also include runners configured to direct molding compound between the mold cavities and into the corners of the mold cavities. The runners prevent trapped air from accumulating in the corners of the mold cavities, and eliminate the need for air vents in the corners. The mold cavity plates also include dummy mold cavities configured to form dummy segments on the leadframe, and air vents in flow communication with the dummy segments. The dummy mold cavities are configured to collect trapped air, and to direct the trapped air through the air vents to atmosphere. Each dummy mold cavity has only a single associated air vent, such that cleaning is facilitated, and flash particles from the air vents are reduced. A method for fabricating semiconductor components includes a molding step performed using the system. A semiconductor component fabricated using the system includes the leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe.
REFERENCES:
patent: 5550711 (1996-08-01), Burns et al.
patent: 5578261 (1996-11-01), Manzione et al.
patent: 5623163 (1997-04-01), Izumi
patent: 5757067 (1998-05-01), Inaba
patent: 5776512 (1998-07-01), Weber
patent: 5853771 (1998-12-01), Matsumoto
patent: 6210992 (2001-04-01), Tandy et al.
patent: 6229202 (2001-05-01), Corisis
patent: 6258624 (2001-07-01), Corisis
patent: 6329829 (2001-12-01), Farnworth et al.
patent: 6331453 (2001-12-01), Bolken et al.
patent: 6439869 (2002-08-01), Seng et al.
patent: 6521980 (2003-02-01), Tandy et al.
patent: 6523254 (2003-02-01), Street et al.
patent: 6537051 (2003-03-01), Tandy
patent: 6626656 (2003-09-01), Thummel
patent: 6638595 (2003-10-01), Rumsey et al.
patent: 6644949 (2003-11-01), Rumsey et al.
patent: 6652799 (2003-11-01), Seng et al.
patent: 6656769 (2003-12-01), Lee et al.
patent: 6660558 (2003-12-01), Bolken et al.
patent: 2002/0186549 (2002-12-01), Bolken
patent: 2003/0034568 (2003-02-01), Chai et al.
patent: 2003/0178748 (2003-09-01), Bolken et al.
patent: 2005/0022378 (2005-02-01), Bolken
patent: 2005/0133159 (2005-06-01), Johnsgard et al.
patent: 354043470 (1979-04-01), None
patent: 356002641 (1981-01-01), None
patent: 355022873 (1983-02-01), None
patent: 358017646 (1983-02-01), None
James Steven L.
Tandy, legal representative Lori
Gratton Stephen A.
Micro)n Technology, Inc.
Williams Alexander Oscar
LandOfFree
System for fabricating semiconductor components using mold... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System for fabricating semiconductor components using mold..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for fabricating semiconductor components using mold... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3464427