Structure of resin molded type semiconductor device with embedde

Details Structure of resin molded type semiconductor device with embedde Structure of resin molded type semiconductor device with embedde

1995-10-23

1999-12-14

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257790, 257713, 257718, 257796, H01L 2328

Patent

active

060021810

ABSTRACT:
A resin molded type semiconductor device has an inner portion sandwiched between two outer surfaces. The device includes a chip support with a first, inwardly facing surface and a second, outwardly facing surface. The device also includes a semiconductor element with a first, inwardly facing surface and a second, outwardly facing surface. The respective first surfaces of the chip support and semiconductor element are fixed to each other. A mold resin is provided to seal the entire semiconductor device except for the respective second surfaces of the chip support and semiconductor element which remain exposed as part of the two outer surfaces of the device, in order to keep the semiconductor device thin.

REFERENCES:
patent: 5157478 (1992-10-01), Ueda et al.
patent: 5391916 (1995-02-01), Kohno et al.
patent: 5442234 (1995-08-01), Liang

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