Embedded chip enclosure with solder-free interconnect
Encapsulant for microelectronic devices
Encapsulant for opto-electronic devices and method for...
Encapsulant method and apparatus
Encapsulant with fluxing properties and method of use in...
Encapsulated chip module and method of making same
Encapsulated chip scale package having flip-chip on lead...
Encapsulated electronic component containing a holding member
Encapsulated electronics device with improved heat dissipation
Encapsulated semiconductor device having metal foil covering, an
Encapsulated semiconductor die package
Encapsulated semiconductor package having protectant circular in
Encapsulated sensor device
Encapsulation of a chip module
Encapsulation of microelectronic assemblies
Encapsulation of thin-film electronic devices
Encapsulation of thin-film electronic devices
Encapsulation of transmitter and receiver modules
Enhancement of underfill physical properties by the addition...
Epoxy polymer filled with aluminum nitride-containing polymer an