Encapsulated electronics device with improved heat dissipation

Details Encapsulated electronics device with improved heat dissipation Encapsulated electronics device with improved heat dissipation

2006-01-31

2006-01-31

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S788000

Reexamination Certificate

active

06992400

ABSTRACT:
A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.

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patent: WO 03/012856 (2003-02-01), None
patent: WO 03/032484 (2003-04-01), None

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