Encapsulated electronic component containing a holding member

Details Encapsulated electronic component containing a holding member Encapsulated electronic component containing a holding member

1996-08-08

1998-06-02

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257726, 257727, 257730, H01L 2328, H01L 2304, H01L 2332

Patent

active

057604819

ABSTRACT:
An encapsulated electronic part has a resin body and a projecting holding member removably attached to the resin body which may be made of the same resin and formed at the same time as the resin body. The encapsulated electronic part may be conveyed to a test device or to a circuit board and mounted thereon by gripping the holding member with a holding device. The holding member may have a shape conforming to the shape of the holding device and may be separated from the resin body by moving the holding device while holding the resin body stationary.

REFERENCES:
patent: 5045923 (1991-09-01), Matsuoka
patent: 5051813 (1991-09-01), Schneider et al.
patent: 5226226 (1993-07-01), Fierkens
patent: 5369058 (1994-11-01), Burns et al.
patent: 5451816 (1995-09-01), Abe et al.
patent: 5574310 (1996-11-01), Sono et al.

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