Encapsulated semiconductor package having protectant circular in

Details Encapsulated semiconductor package having protectant circular in Encapsulated semiconductor package having protectant circular in

1992-06-15

1994-05-03

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257666, 257668, 257675, 257719, 257787, 257792, H01L 2348, H01L 2328, H01L 3902, H01L 2302

Patent

active

053090276

ABSTRACT:
The present invention includes a semiconductor package (20) that has a leadframe (10). An insulator (13) is mounted on a surface of a flag (11) of the leadframe (10) to insulate a portion of the leadframe (10) from the external environment. A semiconductor die (16) is also mounted on the flag (11), spaced away from the insulator (13). A portion of the leadframe (10), the semiconductor die (16), and a portion of the insulator (13) are encapsulated by a body (21) of the package (20). The body (21) also has an alignment hole (23) that extends from a surface of the body to the insulator (13), and exposes a portion of a surface of the insulator (13). In addition, the body (21) overlaps the insulator (13) and forms a seal to the insulator (13) protecting the leadframe (10) from the external environment.

REFERENCES:
patent: 4916518 (1990-04-01), Yoshimura
patent: 5038200 (1991-08-01), Hosomi et al.
Data Sheet, "Tamac 4" Mitsubishi Shindo Co. Limited Tokyo Japan.
Data Sheet, "P-221 1 Mil Kapton Film Circuit Board Masking Tape", Permacel Company, New Brunswick, N.J.

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