Enhancement of underfill physical properties by the addition...

Details Enhancement of underfill physical properties by the addition... Enhancement of underfill physical properties by the addition...

2006-10-10

2006-10-10

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257SE23119, C257SE23116, C257SE23123, C257SE23124, C257SE23125

Reexamination Certificate

active

07119449

ABSTRACT:
An electrical component having improved impact resistance and improved tolerance for thermal cycling, without sacrificing high-temperature performance, and without requiring unconventional and expensive manufacturing techniques includes an electric device mounted on a substrate circuit board, and a composite material underfilling, overmolding or encapsulating the electronic device, wherein the composite material includes a thermoset matrix phase and a discontinuous liquid crystal polymer phase dispersed throughout the thermoset matrix phase.

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European Search Report dated Mar. 15, 2005
Dai, Q., Chen, J., Huang, Y.; “Toughening of Epoxy Resin Blended with Thermotropi Hydroxyethyl Cellulose Acetate”, Journal of Applied Polymer Science, vol. 70, (1998), pp. 1159-1163.

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