Encapsulation of a chip module

Details Encapsulation of a chip module Encapsulation of a chip module

2006-09-12

2009-10-06

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S783000, C257S784000, C257S618000, C257S619000, C257SE23123

Reexamination Certificate

active

07598622

ABSTRACT:
A chip module with a substrate having a top side, a chip mounted on the top side of the substrate, and an encapsulation includes an encapsulation material. The encapsulation is applied on the chip and the top side of the substrate in such a way that the chip and the top side of the substrate are at least partly covered. The encapsulation material includes a polymer composition having at least a first polymer component and a second polymer component which are chemically covalently bonded by means of a crosslinker, the first polymer component imparting resistance toward a first class of chemically reactive compounds and the second polymer component imparting resistance toward a second class of chemically reactive compounds, the reactivities differing between the first and second classes of chemically reactive compounds.

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