LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Encapsulated,With specified encapsulant

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Integrated circuit package with a heat dissipation device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Integrated circuit package-in-package system with leads

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Integrated circuit underfill package system

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Integrated circuits, and methods of fabricating same, which take

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Latent catalysts for molding compounds

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Lead-free glass tubing, especially for encapsulating diodes...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Leadless semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Light-emitting device, planar light source and direct type...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Liquid epoxy resin composition and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Liquid resin composition for electronic part sealing, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Low capacitance coupling wire bonded semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Low profile semiconductor package and process for making the...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Low-melting point glass sealed semiconductor device and method o

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Method and structure for temperature stabilization in...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Method for connecting packages of a stacked ball grid array stru

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Method for encapsulating a semiconductor utilizing an epoxy resi

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Method for fabricating semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Method of reducing memory card edge roughness by edge coating

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Method to improve internal package delamination and wire bond re