Liquid resin composition for electronic part sealing, and...

Details Liquid resin composition for electronic part sealing, and... Liquid resin composition for electronic part sealing, and...

2011-07-19

2011-07-19

Lam, Cathy (Department: 1784)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S788000, C257S793000, C257S795000, C257S780000, C257S783000, C174S259000, C174S260000, C428S320200

Reexamination Certificate

active

07982322

ABSTRACT:
The present invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance and thermal shock resistance). The liquid resin composition for electronic part sealing is characterized by comprising (A) an epoxy resin including a liquid epoxy resin, (B) a hardening agent including a liquid aromatic amine, (C) a hydrazide compound having an average particle diameter of less than 2 μm, and (D) an inorganic filler having an average particle diameter of less than 2 μm.

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English language Translation of International Preliminary Report on Patentability of International Appln. No. PCT/JP2007/069023 dated Apr. 30, 2009.

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