Liquid epoxy resin composition and semiconductor device

Details Liquid epoxy resin composition and semiconductor device Liquid epoxy resin composition and semiconductor device

2006-06-27

2006-06-27

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S793000, C257S795000, C257S798000

Reexamination Certificate

active

07067930

ABSTRACT:
A liquid epoxy resin composition is provided comprising (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) acrylic submicron particles of core-shell structure formed of polymers or copolymers comprising an alkyl acrylate and/or alkyl methacrylate as a monomeric component, the core having a Tg of up to −10° C., the shell having a Tg of 80-150° C. The composition is adherent to surfaces of silicon chips, especially polyimide resins and nitride film and useful as sealant for flip chip type semiconductor devices.

REFERENCES:
patent: 6225704 (2001-05-01), Sumita et al.
patent: 6294271 (2001-09-01), Sumita et al.
patent: 6376923 (2002-04-01), Sumita et al.
patent: 6534193 (2003-03-01), Sumita et al.
patent: 61-19620 (1986-01-01), None
patent: P2000-273149 (1990-10-01), None
patent: 11-106474 (1997-10-01), None

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