Method for encapsulating a semiconductor utilizing an epoxy resi

Details Method for encapsulating a semiconductor utilizing an epoxy resi Method for encapsulating a semiconductor utilizing an epoxy resi

1995-09-07

1997-03-11

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

437219, 528 89, 528 90, 528 92, 257793, H01L 2329

Patent

active

056104430

ABSTRACT:
A method of encapsulating a semiconductor comprising encapsulating a semiconductor in a curable epoxy resin composition comprising a liquid epoxy resin, an inorganic filler, an onium salt compound and an internal releasing agent, and substantially not containing a hardener, and then molding the above composition.

REFERENCES:
patent: 4026862 (1977-05-01), Smith et al.
patent: 5095053 (1992-03-01), Walles et al.

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