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Imaging device equipped with a last copper and aluminum...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Imaging module and method for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
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IMD film composition for dual damascene process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Impedance matched electrical interconnect using dielectric...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
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Implanted hidden interconnections in a semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
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Impurity doped UV protection layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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In situ formation of protective layer on silsesquioxane...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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In situ plasma pre-deposition wafer treatment in chemical...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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In situ plasma pre-deposition wafer treatment in chemical...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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In-plane on-chip decoupling capacitors and method for making...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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In-situ deposition for cu hillock suppression

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Increasing electromigration lifetime and current density in...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Increasing the adhesion of an adhesive connection in housings

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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Inductance reduced wire-bonding type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent

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Inexpensive wafer level MMIC chip packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Inhibiting underfill flow using nanoparticles

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Inhibiting underfill flow using nanoparticles

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Innovative solder ball pad structure to ease design rule,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
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Innovative solder ball pad structure to ease design rule,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
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Input and output circuit of an integrated circuit chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
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