Inhibiting underfill flow using nanoparticles

Details Inhibiting underfill flow using nanoparticles Inhibiting underfill flow using nanoparticles

2008-01-08

2008-01-08

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S777000, C257SE21134, C257SE21475, C257SE21511

Reexamination Certificate

active

07317257

ABSTRACT:
A method and apparatus for inhibiting the flow of a flowable adhesive material disposed adjacent to a substrate. A chip component is disposed adjacent to a substrate and a plurality of nanoparticles are disposed and cured adjacent to the substrate and proximate to the chip component. The nanoparticles possess surface properties that make them substantially immiscible with a flowable adhesive. The band of nanoparticles will inhibit the flow of a flowable adhesive material disposed between the chip and the nanoparticles, in a direction bounded by the plurality of nanoparticles, while adhesive flow in the direction of the component is promoted.

REFERENCES:
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patent: 6716629 (2004-04-01), Hess et al.
patent: 6803090 (2004-10-01), Castiglione et al.
patent: 6866928 (2005-03-01), Narum et al.
patent: 6949176 (2005-09-01), Vacca et al.
patent: 2002/0094533 (2002-07-01), Hess et al.
patent: 2003/0180897 (2003-09-01), Ulrich et al.

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