Increasing the adhesion of an adhesive connection in housings

Details Increasing the adhesion of an adhesive connection in housings Increasing the adhesion of an adhesive connection in housings

2008-06-24

2008-06-24

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S678000, C257S739000, C257S773000, C257S776000, C257S782000, C257SE23020, C257SE23037, C257SE23040

Reexamination Certificate

active

07391120

ABSTRACT:
A housing having a non-detachable bond to a micromechanical component using a flexible bonding material in particular. The combination including the housing and the micromechanical component as well as the manufacturing method of this combination. At least part of the component and/or of the housing has depressions for receiving the bonding material. These depressions may be designed as grooves, for example.

REFERENCES:
patent: 6224711 (2001-05-01), Carden et al.
patent: 6707152 (2004-03-01), Schrock
patent: 6831372 (2004-12-01), Ruhland
patent: 6838758 (2005-01-01), Montiel

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