Inhibiting underfill flow using nanoparticles

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S777000, C257SE21134, C257SE21475, C257SE21511

Reexamination Certificate

active

11304510

ABSTRACT:
A method and apparatus for inhibiting the flow of a flowable adhesive material disposed adjacent to a substrate. A chip component is disposed adjacent to a substrate and a plurality of nanoparticles are disposed and cured adjacent to the substrate and proximate to the chip component. The nanoparticles possess surface properties that make them substantially immiscible with a flowable adhesive. The band of nanoparticles will inhibit the flow of a flowable adhesive material disposed between the chip and the nanoparticles, in a direction bounded by the plurality of nanoparticles, while adhesive flow in the direction of the component is promoted.

REFERENCES:
patent: 5843767 (1998-12-01), Beattie
patent: 6716629 (2004-04-01), Hess et al.
patent: 6803090 (2004-10-01), Castiglione et al.
patent: 6866928 (2005-03-01), Narum et al.
patent: 6949176 (2005-09-01), Vacca et al.
patent: 2002/0094533 (2002-07-01), Hess et al.
patent: 2003/0180897 (2003-09-01), Ulrich et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Inhibiting underfill flow using nanoparticles does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Inhibiting underfill flow using nanoparticles, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Inhibiting underfill flow using nanoparticles will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3941240

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.