Imaging module and method for forming the same

Details Imaging module and method for forming the same Imaging module and method for forming the same

2006-03-08

2008-10-28

Louie, Wai-Sing (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257SE23169

Reexamination Certificate

active

07443028

ABSTRACT:
An imaging module is formed by stacking: a first resin board; a second resin board having a first opening; a first electrically-conductive member electrically connecting the first resin board and the second resin board to each other; a printed circuit board having a second opening; a second electrically-conductive member electrically connecting the second resin board and the printed circuit board to each other; an imaging semiconductor chip mounted on the lower surface of the second resin board to cover the first opening and provided with an imaging sensor, an optical member placed on the upper surface of the second resin board to cover the first opening; a first semiconductor control chip provided with a control device for controlling operation of the imaging sensor and mounted on the lower surface of the first resin board.

REFERENCES:
patent: 5617131 (1997-04-01), Murano et al.
patent: 6266197 (2001-07-01), Glenn et al.
patent: 6674159 (2004-01-01), Peterson et al.
patent: 6740973 (2004-05-01), Hsin
patent: 2004/0069998 (2004-04-01), Harazono
patent: 2008/0044127 (2008-02-01), Leising et al.
patent: 2002-296435 (2002-10-01), None
patent: 2002-354200 (2002-12-01), None
patent: 2003-218273 (2003-07-01), None
Chinese Office Action, with English Translation, issued in corresponding Chinese Patent Application No. 200610054943.8, issued on Jan. 4, 2008.

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