LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Combined with electrical contact or lead

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Circuit device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit device and method of manufacturing thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit device having a multi-layer conductive path

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit device with at least partial packaging and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit device with bonding strength improved and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit device, a method for manufacturing a circuit device,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit edit interconnect structure through the backside of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit electrode connected to a pattern formed on an...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit fabrication using a particle filled adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit film with bump, film package using the same, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit layout structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit probing contact pad formed on a bond pad in a flip...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit signal connection interface, a manufacture method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit structure and process thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit structure having a matrix of active devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit structure including a passive element formed within...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit structure of package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit structure, manufacturing method thereof and wiring...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit substrate and its manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Circuit substrate and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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