Circuit device and method of manufacturing thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

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Details

C257S779000, C257S786000, C257SE23011, C257SE23021

Reexamination Certificate

active

07808114

ABSTRACT:
A circuit device of preferred embodiments of the present invention includes: a circuit element with electrodes formed in a peripheral part thereof; connecting portions connected to surfaces of the electrodes; and redistribution lines which are continuous to the respective connecting portions and extended in parallel to the main surface of the circuit element. In preferred embodiments of the present invention, the connecting portions and the redistribution lines are integrally formed of one piece of metal. Accordingly, there is no place where different materials are connected in a portion between the connecting portions and the redistribution lines, thus improving a joint reliability of the entire device against a thermal stress or the like.

REFERENCES:
patent: 5451801 (1995-09-01), Anderson et al.
patent: 6359221 (2002-03-01), Yamada et al.
patent: 6610558 (2003-08-01), Chen
patent: 6936769 (2005-08-01), Noguchi et al.
patent: 2003/0207574 (2003-11-01), Aiba et al.
patent: 2004/0041251 (2004-03-01), Goller et al.
patent: 2005/0017343 (2005-01-01), Kwon et al.
patent: 2005/0230846 (2005-10-01), Chang et al.
patent: 2006/0022350 (2006-02-01), Watkins
patent: 09-064049 (1997-03-01), None
patent: 09-275125 (1997-10-01), None
patent: 2000-269269 (2000-09-01), None
patent: 2001-223287 (2001-08-01), None
patent: 2004-039761 (2004-02-01), None

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