Circuit device and method of manufacturing thereof

Details Circuit device and method of manufacturing thereof Circuit device and method of manufacturing thereof

2006-04-24

2010-10-05

Warren, Matthew E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S779000, C257S786000, C257SE23011, C257SE23021

Reexamination Certificate

active

07808114

ABSTRACT:
A circuit device of preferred embodiments of the present invention includes: a circuit element with electrodes formed in a peripheral part thereof; connecting portions connected to surfaces of the electrodes; and redistribution lines which are continuous to the respective connecting portions and extended in parallel to the main surface of the circuit element. In preferred embodiments of the present invention, the connecting portions and the redistribution lines are integrally formed of one piece of metal. Accordingly, there is no place where different materials are connected in a portion between the connecting portions and the redistribution lines, thus improving a joint reliability of the entire device against a thermal stress or the like.

REFERENCES:
patent: 5451801 (1995-09-01), Anderson et al.
patent: 6359221 (2002-03-01), Yamada et al.
patent: 6610558 (2003-08-01), Chen
patent: 6936769 (2005-08-01), Noguchi et al.
patent: 2003/0207574 (2003-11-01), Aiba et al.
patent: 2004/0041251 (2004-03-01), Goller et al.
patent: 2005/0017343 (2005-01-01), Kwon et al.
patent: 2005/0230846 (2005-10-01), Chang et al.
patent: 2006/0022350 (2006-02-01), Watkins
patent: 09-064049 (1997-03-01), None
patent: 09-275125 (1997-10-01), None
patent: 2000-269269 (2000-09-01), None
patent: 2001-223287 (2001-08-01), None
patent: 2004-039761 (2004-02-01), None

Affiliated with

Also associated with

Rating

Circuit device and method of manufacturing thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit device and method of manufacturing thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit device and method of manufacturing thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4172134