Circuit device having a multi-layer conductive path

Details Circuit device having a multi-layer conductive path Circuit device having a multi-layer conductive path

2005-08-30

2005-08-30

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S700000, C257S782000, C257S738000

Reexamination Certificate

active

06936927

ABSTRACT:
A circuit device and a method for fabrication the same is provided. An insulation resin sheet in which the first conductive layer3and the second conductive layer4are adhered to each other by insulation resin2is used. The first conductive path layer5is formed by the first conductive layer3, the second conductive path layer6is formed by the second conductive layer4, and both of the conductive path layers are connected by multi-layer connecting means12. Since a semiconductor element7is adhered to and fixed on overcoating resin8that covers the first conductive path layer5, a multi-layer connection structure can be achieved by the first conductive path layer5and the second conductive path layer6. Further, the second conductive layer4that is made thick can prevent warping from occurring due to a difference in a thermal expansion coefficient.

REFERENCES:
patent: 5473512 (1995-12-01), Degani et al.
patent: 6365979 (2002-04-01), Miyajima
patent: 6384344 (2002-05-01), Asai et al.
patent: 6400010 (2002-06-01), Murata
patent: 6410979 (2002-06-01), Abe
patent: 6487088 (2002-11-01), Asai et al.
patent: 6518090 (2003-02-01), Dotta et al.
patent: 6573595 (2003-06-01), Chen et al.
patent: 6617695 (2003-09-01), Kasatani
patent: 6664138 (2003-12-01), Igarashi et al.
patent: 6707152 (2004-03-01), Schrock
patent: 6731013 (2004-05-01), Juso et al.
patent: 2001/0038145 (2001-11-01), Mashino
patent: 2003/0082846 (2003-05-01), Yoneda et al.

Affiliated with

Also associated with

Rating

Circuit device having a multi-layer conductive path does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit device having a multi-layer conductive path, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit device having a multi-layer conductive path will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3517190