Circuit device, a method for manufacturing a circuit device,...

Details Circuit device, a method for manufacturing a circuit device,... Circuit device, a method for manufacturing a circuit device,...

2008-02-28

2010-06-29

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S734000, C257S737000, C257S775000, C257S780000

Reexamination Certificate

active

07745938

ABSTRACT:
A circuit device includes a semiconductor substrate on which a circuit element is formed, an electrode formed on a surface of the semiconductor substrate, an insulating layer formed on the electrode, a second wiring layer formed on the insulating layer, and a conductive bump which penetrates the insulating layer and electrically connects the electrode and the second wiring layer. The conductive bump is such that the size of crystal grains in a direction parallel with the surface of the semiconductor substrate is larger than the size of crystal grains in a conduction direction of the electrode and the wiring layer.

REFERENCES:
patent: 4134848 (1979-01-01), Adicoff et al.
patent: 4335180 (1982-06-01), Traut
patent: 4352239 (1982-10-01), Pierce
patent: 4438450 (1984-03-01), Sheng et al.
patent: 4845543 (1989-07-01), Okikawa et al.
patent: 5055342 (1991-10-01), Markovich et al.
patent: 5144536 (1992-09-01), Tsukada et al.
patent: 5316803 (1994-05-01), White et al.
patent: 5607744 (1997-03-01), Diener et al.
patent: 5972482 (1999-10-01), Hatakeyama et al.
patent: 6038133 (2000-03-01), Nakatani et al.
patent: 6090701 (2000-07-01), Hasunuma et al.
patent: 6143207 (2000-11-01), Yamada et al.
patent: 6285082 (2001-09-01), Joshi et al.
patent: 6306756 (2001-10-01), Hasunuma et al.
patent: 6459047 (2002-10-01), Japp et al.
patent: 6528145 (2003-03-01), Berger et al.
patent: 6796025 (2004-09-01), Imamura et al.
patent: 6896953 (2005-05-01), Taga et al.
patent: 7187005 (2007-03-01), Koo et al.
patent: 7315083 (2008-01-01), Igarashi et al.
patent: 7335910 (2008-02-01), Kato et al.
patent: 7619255 (2009-11-01), Tanaka et al.
patent: 2002/0096768 (2002-07-01), Joshi
patent: 2002/0185309 (2002-12-01), Imamura et al.
patent: 2003/0168495 (2003-09-01), Biedorf et al.
patent: 2004/0217353 (2004-11-01), Koo et al.
patent: 2006/0049483 (2006-03-01), Lin et al.
patent: 2007/0082183 (2007-04-01), Murai et al.
patent: 2008/0157338 (2008-07-01), Nakasato et al.
patent: 04354337 (1992-12-01), None
patent: 05-235544 (1993-09-01), None
patent: 09-289264 (1997-11-01), None
patent: 09-312479 (1997-12-01), None
patent: 11-298143 (1999-10-01), None
patent: 2001-144206 (2001-05-01), None
patent: 2004-193297 (2004-07-01), None
patent: 2004-288795 (2004-10-01), None
patent: 2005-286041 (2005-10-01), None
Apr. 16, 2009 Office action in U.S. Appl. No. 11/957,030.

Affiliated with

Also associated with

Rating

Circuit device, a method for manufacturing a circuit device,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit device, a method for manufacturing a circuit device,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit device, a method for manufacturing a circuit device,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4243572