Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2007-03-13
2007-03-13
Andujar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S739000, C257S773000, C438S613000
Reexamination Certificate
active
11158164
ABSTRACT:
A circuit film having film bumps is provided for a film package. An IC chip is mechanically joined and electrically coupled to the circuit film through the film bumps instead of conventional chip bumps. In a fabrication method, a base film is partially etched by a laser to create an etched area that defines raised portion relatively raised from the etched area. Then a circuit pattern is selectively formed on the base film, partly running over the raised portions. The raised portion and the overlying circuit pattern constitute the film bumps having a height not greater than the height of the circuit film.
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Choi Kyoung-Sei
Kang Sa-Yoon
Kwon Yong-Hwan
Lee Chung-Sun
Andujar Leonardo
Marger & Johnson & McCollom, P.C.
Samsung Electronics Co,. Ltd.
Soderholm Krista
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