Integrated circuit method for and structure with narrow line wid
Integrated circuit package bond pad having plurality of...
Integrated circuit package in which impendance between signal pa
Integrated circuit structure having contact openings and vias fi
Integrated circuit structure having low dielectric constant...
Integrated circuit structure with thin dielectric between at...
Integrated circuit system with dummy region
Integrated circuit which uses a damascene process for producing
Integrated circuit which uses a recessed local conductor for pro
Integrated circuit with a titanium nitride contact barrier havin
Integrated circuit with a titanium nitride contact barrier havin
Integrated circuit with active devices under bond pads
Integrated circuit with active regions having varying...
Integrated circuit with bonding layer over active circuitry
Integrated circuit with contact region and multiple etch...
Integrated circuit with dielectric diffusion barrier layer...
Integrated circuit with dielectric diffusion barrier layer...
Integrated circuit with enhanced planarization
Integrated circuit with improved adhesion between interfaces...
Integrated circuit with improved component interconnections