Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2008-09-23
2010-06-22
Purvis, Sue (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
Reexamination Certificate
active
07741719
ABSTRACT:
An integrated circuit system comprised by forming a first region, a second region and a third region within a dielectric over a substrate. The first region includes tungsten plugs. The second region is formed adjacent at least a portion of the perimeter of the first region and the third region is formed between the first region and the second region. An opening is formed in the third region and a material is deposited within the opening for preventing erosion of the first region.
REFERENCES:
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patent: 6093631 (2000-07-01), Jaso et al.
patent: 6849946 (2005-02-01), Sethuraman et al.
patent: 2002/0106886 (2002-08-01), Sethuraman et al.
Chen Feng
Lim Cing Ge
Liu Dong Sheng
Mahadevan Subbiah Chettiar
Chartered Semiconductor Manufacturing Ltd.
Ishimaru Mikio
Purvis Sue
Soderholm Krista
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