Integrated circuit with improved component interconnections

Details Integrated circuit with improved component interconnections Integrated circuit with improved component interconnections

2006-09-21

2010-02-02

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23155, C257SE23152, C257SE27005, C257SE27014, C257SE43006, C257SE27048, C257SE21012, C257SE27112, C257SE21703, C257S303000, C257S296000, C257S298000, C257S300000, C257S301000, C257S308000, C257S347000, C372S046012, C372S029011

Reexamination Certificate

active

07656037

ABSTRACT:
An integrated circuit arrangement is disclosed. In one embodiment, the integrated circuit arrangement includes at least three conductive structures levels and elongated interconnects.

REFERENCES:
patent: 5943598 (1999-08-01), Lin
patent: 6297524 (2001-10-01), Vathulya et al.
patent: 6480086 (2002-11-01), Kluge et al.
patent: 6690570 (2004-02-01), Hajimiri et al.
patent: 6770512 (2004-08-01), Mahanpour et al.
patent: 6808975 (2004-10-01), Song et al.
patent: 7463112 (2008-12-01), Groves
patent: 2004/0142583 (2004-07-01), Mathieu et al.
patent: 2005/0117315 (2005-06-01), Weekamp
patent: 2007/0008060 (2007-01-01), Weller et al.
patent: 2007/0071052 (2007-03-01), Hommel et al.
patent: 2007/0254448 (2007-11-01), Bhatt et al.
patent: 2008/0070339 (2008-03-01), Power et al.
patent: 2008/0100408 (2008-05-01), Chen
patent: 2008/0224318 (2008-09-01), Hommel et al.
patent: 102 49 192 (2002-10-01), None
patent: 0 905 778 (1999-03-01), None
German Office Action dated Nov. 27, 2008 with English translation (4 pgs).
Patent Search Report of Application No. 095134498 (1 sheet).
Office Action dated Mar. 12, 2009, for U.S. Appl. No. 11/525,111 (7 sheets).

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