4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum
  Search
Selected: C
All A B
C
D E F G H I J K L M N O P Q R S T U V W X Y Z 0 1 2 3 4 5 6 7 8 9 ! " $ ' ( ) * , - / : < = > ? @ [ \ ] ^ ` { | } ~ €

Carbon-graded layer for improved adhesion of low-k...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Carrier with a metal area and at least one chip configured...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Cast metal seal for semiconductor substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Ceramic substrate having pads to be attached to terminal members

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Ceramic-to-conducting-lead hermetic seal

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chemical vapor deposition of titanium

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chemical vapor deposition of titanium

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip crack stop design for semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip interconnect wiring structure with low dielectric...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip structure and process for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip structure and process for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip structure and process for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip structure and process for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip structure and process for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip structure and process for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip structure and process for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip to wiring interface with single metal alloy layer...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip-size semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Circuit board assembly and packaged integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Circuit board structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0
  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure