Chip structure and process for forming the same

Details Chip structure and process for forming the same Chip structure and process for forming the same

2007-12-18

2007-12-18

Jackson, Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE21575, C257S298000, C257S300000, C257S528000, C365S185010

Reexamination Certificate

active

11123936

ABSTRACT:
A chip or wafer comprises a semiconductor substrate, first and second transistors on the semiconductor substrate, first and second metal layers over the semiconductor substrate, an insulating layer on the first and second metal layers, a third and fourth metal layers on the insulating layer, a passivation layer over the third and fourth metal layers, and a fifth metal layer over the passivation layer. A signal is suited to be transmitted from the first transistor to the second transistor sequentially through the first, third, fifth, fourth and second metal layers.

REFERENCES:
patent: 3573570 (1971-04-01), Fuller et al.
patent: 4189909 (1980-02-01), Marum
patent: 4423547 (1984-01-01), Farrar et al.
patent: 4618878 (1986-10-01), Aoyama et al.
patent: 4959705 (1990-09-01), Lemnios et al.
patent: 4984061 (1991-01-01), Matsumoto
patent: 5065222 (1991-11-01), Ishii
patent: 5083187 (1992-01-01), Lamson et al.
patent: 5109267 (1992-04-01), Koblinger et al.
patent: 5384488 (1995-01-01), Golshan et al.
patent: 5476726 (1995-12-01), Harada et al.
patent: 5514892 (1996-05-01), Countryman et al.
patent: 5545909 (1996-08-01), Williams et al.
patent: 5578849 (1996-11-01), Tadaki et al.
patent: 5578860 (1996-11-01), Costa et al.
patent: 5798568 (1998-08-01), Abercrombie et al.
patent: 5834844 (1998-11-01), Akagawa et al.
patent: 5838043 (1998-11-01), Yuan
patent: 5959357 (1999-09-01), Korman
patent: 5960308 (1999-09-01), Akagawa et al.
patent: 5969424 (1999-10-01), Matsuki et al.
patent: 5973374 (1999-10-01), Longcor
patent: 6018183 (2000-01-01), Hsu
patent: 6214630 (2001-04-01), Hsuan et al.
patent: 6229221 (2001-05-01), Kloen et al.
patent: 6232147 (2001-05-01), Matsuki et al.
patent: 6303977 (2001-10-01), Schroen et al.
patent: 6448641 (2002-09-01), Ker et al.
patent: 6489689 (2002-12-01), Nojiri
patent: 6605873 (2003-08-01), Vigna et al.
patent: WO 00/35013 (2000-06-01), None

Affiliated with

Also associated with

Rating

Chip structure and process for forming the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip structure and process for forming the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip structure and process for forming the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3830393