Barrier material for copper structures
Barrier material formation in integrated circuit structures
Barrier materials for metal interconnect in a semiconductor...
Barrier materials for semiconductor devices
Barrier metal integrity testing using a dual level line to...
Barrier metal layer
Barrier metal technology for tungsten plug interconnection
Barrier-less plug structure
Barrier-metal-free copper damascene technology using atomic...
Barrier-metal-free copper damascene technology using atomic...
Barrier-to-seed layer alloying in integrated circuit...
Base layer structure covering a hole of decreasing diameter in a
BEOL decoupling capacitor
BEOL decoupling capacitor
BEOL interconnect structures with improved resistance to stress
Bi-layer etch stop process for defect reduction and via...
Bias plasma deposition for selective low dielectric insulation
BICMOS semiconductor integrated circuit device and...
BICMOS semiconductor integrated circuit device and...
Bilayer electrode on a n-type semiconductor