Circuit tape having adhesive film, semiconductor device, and...
Composite interposer for BGA packages
Conductive adhesive agent with ultrafine particles
Conductive adhesive and article made therewith
Conductive diffusion barrier of titanium nitride in ohmic contac
Conductive hardening resin for a semiconductor device and...
Conductive polymer device and method of manufacturing same
Configuration and method for contacting circuit structure
Crack resistant scribe line monitor structure and method for...
Delamination-preventing substrate and semiconductor package...
Dicing tape and die attach adhesive with patterned backing
Die attach adhesives for semiconductor applications...
Die attach material for TBGA or flexible circuitry
Die attachment with reduced adhesive bleed-out
Die pillar structures and a method of their formation
Durable electronic assembly with conductive adhesive
Electrically isolated power semiconductor package
Electrically isolated power semiconductor package
Electro-optic device and method for manufacturing the same
Electronic assembly having composite electronic contacts for...