Die attach material for TBGA or flexible circuitry

Details Die attach material for TBGA or flexible circuitry Die attach material for TBGA or flexible circuitry

2006-03-28

2006-03-28

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S738000, C257S780000, C438S118000, C156S330000

Reexamination Certificate

active

07019410

ABSTRACT:
An attachment material is provided between the die and the solder balls of a TBGA or other flexible circuitry package that is sufficiently compliant to absorb pressure between the two, so as not to apply stress to the solder balls. The attachment material is also sufficiently rigid, with a low coefficient of thermal expansion (CTE), so that the material does not excessively expand and contract during thermal cycling relative to the die. More preferably, the attachment material has a CTE close to that of the die to prevent breakage of the tape at the junction between the tape and the die.

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