Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
1999-09-22
2001-10-23
Ngô ;, Ngâ ;n V. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S782000, C257S784000, C257S786000
Reexamination Certificate
active
06307270
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to an electro-optic device, more particularly to an electro-optic device having a transparent glass substrate with circuit traces provided thereon, and to a method for manufacturing the electro-optic device.
2. Description of the Related Art
Electro-optic devices, such as a liquid crystal display panel, a charge-coupled device and a light emitting diode, generally include a transparent glass substrate having circuit traces provided thereon. Since the procedures for manufacturing a charge-coupled device and a liquid crystal display panel are generally similar, only the steps involved in the manufacture of a liquid crystal display panel will be described herein.
Referring to
FIG. 1
, a conventional liquid crystal display panel
1
is shown to comprise a transparent glass substrate
10
, a plurality of integrated circuits
11
, such as data driving or scan driving integrated circuits, and an integrated circuit controller
12
for controlling operation of the integrated circuits
11
. The glass substrate
10
has a pad mounting surface
14
provided with a plurality of contact pads
13
. The integrated circuits
11
are connected electrically to the contact pads
13
, and the controller
12
is connected electrically to the integrated circuits
11
via wires
15
using known wire-bonding techniques.
Some of the drawbacks of the conventional liquid crystal display panel
1
are as follows:
1. An expensive wire-bonding machine is needed to establish connection among the integrated circuits
11
, the controller
12
and the contact pads
13
, thereby increasing the production costs. Also, defective products are produced during the wire-bonding operation due to inadequacies of the latter. Particularly, defective products are formed when wires break or fall out of alignment with the contact pads
13
during the wire-bonding operation, thereby reducing the production yield.
2. The wires
15
are susceptible to oxidation and corrosion because they are exposed to air, thereby affecting the reliability of the liquid crystal display panel
1
.
3. Because of the arrangement of the glass substrate
10
, the integrated circuits
11
and the controller
12
, the liquid crystal display panel
1
has a relatively large thickness that cannot be reduced.
SUMMARY OF THE INVENTION
Therefore, the object of the present invention is to provide an electro-optic device and a method for manufacturing an electro-optic device capable of overcoming the aforesaid drawbacks that are associated with the prior art.
According to one aspect of the present invention, an electro-optic device comprises:
a transparent glass substrate having a pad mounting surface with a plurality of first contact pads provided thereon;
a dielectric tape layer having opposite first and second adhesive surfaces, the first adhesive surface being adhered onto the pad mounting surface of the glass substrate, the dielectric tape layer being formed with a plurality of holes at positions registered with the first contact pads, each of the holes being confined by a wall that cooperates with a registered one of the first contact pads to form a contact receiving space;
a plurality of conductive contacts placed in the contact receiving spaces, respectively; and
a semiconductor die having a die mounting surface adhered onto the second adhesive surface of the dielectric tape layer, the die mounting surface being provided with a plurality of second contact pads that are bonded to the conductive contacts to establish electrical connection with the first contact pads.
According to another aspect of the invention, a method for manufacturing an electro-optic device comprises:
adhering a first adhesive surface of a dielectric tape layer onto a pad mounting surface of a transparent glass substrate, the dielectric tape layer being formed with a plurality of holes registered with first contact pads that are provided on the pad mounting surface, each of the holes being confined by a wall that cooperates with a registered one of the first contact pads to form a contact receiving space;
placing a plurality of conductive contacts in the contact receiving spaces, respectively; and
adhering a die mounting surface of a semiconductor die onto a second adhesive surface of the dielectric tape layer opposite to the first adhesive surface, and bonding second contact pads that are provided on the die mounting surface to the conductive contacts to establish electrical connection with the first contact pads.
REFERENCES:
patent: 6153930 (2000-11-01), Hori
patent: 6177731 (2001-01-01), Ishida et al.
patent: 6208525 (2001-03-01), Imasu et al.
patent: 6214642 (2001-04-01), Chen et al.
Merchant & Gould P.C.
Ngô ; Ngâ ;n V.
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