4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Die bond
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Delamination-preventing substrate and semiconductor package...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Dicing tape and die attach adhesive with patterned backing

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Die attach adhesives for semiconductor applications...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Die attach material for TBGA or flexible circuitry

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Die attachment with reduced adhesive bleed-out

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Die pillar structures and a method of their formation

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Durable electronic assembly with conductive adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0
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