Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2011-08-30
2011-08-30
Smith, Matthew (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257SE21214, C257SE21599, C257SE21505, C438S464000, C438S459000, C156S060000
Reexamination Certificate
active
08008783
ABSTRACT:
Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
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International Search Report for PCT/US2009/035948, pp. 3.
Benson, Jr. Olester
Getschel Joel A.
Larson Eric G.
Plaut David J.
3M Innovative Properties Company
Baptiste Wilner Jean
Smith Matthew
Wolf Stephen F.
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