LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Combined with electrical contact or lead,Die bond

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Adhesive and semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

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Adhesive composition and methods for use in packaging...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Adhesive film composition, associated dicing die bonding...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Adhesive film for manufacturing semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Adhesive for electronic components, method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Adhesive pattern for attaching semiconductor chip onto...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Adhesive tape and semiconductor package using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Anisotropic conductive coatings and electronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

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Anisotropic conductive film, method of mounting...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

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Anisotropic conductor film, semiconductor chip, and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Apparatus and method for providing mechanically pre-formed...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

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Apparatus and method for signal bus line layout in...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Apparatus and methods of testing and assembling bumped...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

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Apparatus and methods of testing and assembling bumped...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Apparatus for processing semiconductor devices in a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Attachment of ceramic chip carriers to printed circuit boards

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Patent

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Attachment system and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Patent

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Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Bare chip mounting structure and manufacturing method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Patent

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BGA package having substrate with patterned solder mask...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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