Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2006-04-25
2006-04-25
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S782000, C438S106000, C438S118000, C438S120000
Reexamination Certificate
active
07034403
ABSTRACT:
An electronic assembly comprising a first electronic element, a second electronic element, and a durably flexible bond therebetween. The bond comprises an anisotropic conductive adhesive that includes elongated electrically conductive particles. The bond provides at least one electrical pathway between the first electronic element and the second electronic element through an elongated contact region. This bond is functionally maintained for at least about 200 flexes.
REFERENCES:
patent: 3475213 (1969-10-01), Stow
patent: 4113981 (1978-09-01), Fujita et al.
patent: 4226247 (1980-10-01), Hauser et al.
patent: 4457796 (1984-07-01), Needham
patent: 4548862 (1985-10-01), Hartman
patent: 4606962 (1986-08-01), Reylek et al.
patent: 4737112 (1988-04-01), Jin et al.
patent: 5240761 (1993-08-01), Calhoun et al.
patent: 5300340 (1994-04-01), Calhoun et al.
patent: 5415717 (1995-05-01), Perneborn
patent: 5616206 (1997-04-01), Sakatsu et al.
patent: 5665212 (1997-09-01), Zhong et al.
patent: 5672400 (1997-09-01), Hansen et al.
patent: 5725707 (1998-03-01), Koon et al.
patent: 5817374 (1998-10-01), Detig et al.
patent: 5851644 (1998-12-01), McArdle et al.
patent: 5891367 (1999-04-01), Basheer et al.
patent: 5916641 (1999-06-01), McArdle et al.
patent: 6447898 (2002-09-01), Pfaff
patent: 6451418 (2002-09-01), Tobita
patent: 6646350 (2003-11-01), Tanaka et al.
patent: 6884833 (2005-04-01), Chheang et al.
patent: 6888257 (2005-05-01), Wilson et al.
patent: 2002/0119255 (2002-08-01), Divigalpitiya et al.
patent: 2002/0158232 (2002-10-01), Mitani et al.
patent: 2003/0051807 (2003-03-01), Yamaguchi et al.
patent: 2003/0100654 (2003-05-01), Chheang et al.
patent: 452 052 (1948-10-01), None
patent: 0 691 660 (1996-01-01), None
patent: 0691660 (1996-01-01), None
patent: 0 937 315 (2001-09-01), None
patent: 1 219 693 (2002-07-01), None
patent: 2002-198473 (2002-07-01), None
patent: WO 99/67088 (1999-12-01), None
patent: WO 00/01782 (2000-01-01), None
patent: WO 01/64807 (2001-07-01), None
patent: WO 01/85358 (2001-11-01), None
patent: WO 02/067315 (2002-04-01), None
Lyons et al., “Electrically Conductive Adhesives”,Handbook of Adhesive Technology, 1994, pp. 565-584.
International Standard ISO/IEC 10373-1, Identification cards—Test methods—Part 1: General characteristics tests, 1stEdition, Dec. 15, 1998, pp. 1-21.
International Standard ISO/IEC 10373-2, Identification cards—Test methods—Part 2: Cards with magnetic stripes, 1stEdition, Dec. 15, 1998, pp. 1-27.
International Standard ISO/IEC 10373-3, Identification cards—Test methods—Part 3: Integrated circuit(s) cards with contacts and related interface devices, 1stEdition, Feb. 15, 2001, pp. 1-80.
Arnold Christophe
Connell Glen
Divigalpitiya Ranjith
Jannic Patrice
Kanno David A.
3M Innovative Properties Company
Flynn Nathan J.
Harts Dean M.
Mandala Jr. Victor A.
LandOfFree
Durable electronic assembly with conductive adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Durable electronic assembly with conductive adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Durable electronic assembly with conductive adhesive will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3533572