Crack resistant scribe line monitor structure and method for...

Details Crack resistant scribe line monitor structure and method for... Crack resistant scribe line monitor structure and method for...

2006-08-15

2006-08-15

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S777000, C257SE27137, C257SE27144

Reexamination Certificate

active

07091621

ABSTRACT:
A method and structure prevents crack propagation to the active die circuitry of a main die area during sawing around the outer periphery of the main die area. Stress relief elements, such as dummy vias, are provided in the scribe line area between the saw lane and the main die area. The dummy vias prevent cracks induced by the sawing process from propagating to the main die area.

REFERENCES:
patent: 5538924 (1996-07-01), Chen
patent: 6180261 (2001-01-01), Inoue et al.
patent: 6197618 (2001-03-01), Guillot et al.
patent: 6326296 (2001-12-01), Tsai et al.
patent: 6451681 (2002-09-01), Greer
patent: 6653710 (2003-11-01), Adkisson et al.

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