LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Combined with electrical contact or lead,Bump leads

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Spherical semiconductor device and method for fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Spherical semiconductor device and method for fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Stacked contact bump

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Stacked imager package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Stacked imager package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Stacking structure for semiconductor chips and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Standing chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Standing chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Standoff height improvement for bumping technology using...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Stress mitigation layer to reduce under bump stress...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Structurally-enhanced integrated circuit package and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Structure and method for producing multiple size...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Structure for bonding semiconductor device to substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Patent

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Structure for composite bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Patent

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Structure for joining a semiconductor package to a substrate...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Structure for mounting a bare chip using an interposer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Structure for packaging semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Patent

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Stud-cone bump for probe tips used in known good die carriers

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Substrate based IC-package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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