Standing chip scale package

Details Standing chip scale package Standing chip scale package

2008-06-30

2011-11-08

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S693000, C257S737000, C257SE23021, C257SE23023, C257SE23069

Reexamination Certificate

active

08053891

ABSTRACT:
A standing chip scale package is disclosed. The standing chip scale package provides electrical connection to bumped device contacts on both sides of the chip. The package is coupleable to a printed circuit board in a standing configuration such that front and back sides of the bumped chip are substantially perpendicular to a mounting surface. A process of fabricating the standing chip scale package is also disclosed.

REFERENCES:
patent: 6392305 (2002-05-01), Huang et al.
patent: 6646329 (2003-11-01), Estacio et al.
patent: 6653740 (2003-11-01), Kinzer et al.
patent: 6767820 (2004-07-01), Standing et al.
patent: 6841416 (2005-01-01), Yoon et al.
patent: 6870261 (2005-03-01), Hu et al.
patent: 7095226 (2006-08-01), Wan et al.
patent: 2005/0122100 (2005-06-01), Wan et al.

Affiliated with

Also associated with

Rating

Standing chip scale package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Standing chip scale package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Standing chip scale package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4264882